Publication
Integrated 5.7 GHz chip-size antenna for wireless sensor networks
| Summary: | We report on design, fabrication and characterization of chip-size antennas for operation at 5.7 GHz and use in wireless sensor networks. Application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna types (patch and folded patch) allows on-chip integration and is the main novelty of our work. A short-range wireless link between two systems both equipped with an 8x8 mm2 patch antenna (measured characteristics: 5.705 GHz central frequency, 90 MHz bandwidth @ -10 dB, 0.3 dB gain, 18% efficiency) realized on a high-resistivity silicon (HRS) substrate is demonstrated. A folded-patch antenna built on two stacked glass substrates allows size reduction down to 4.5x4x1 mm3 and has a projected efficiency of 60%. |
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| Main Authors: | Mendes, P. M. |
| Other Authors: | Polyakov, A.; Bartek, M.; Burghartz, J. N.; Correia, J. H. |
| Subject: | Integrated antenna Wireless sensor networks Wafer level packaging Antenna measurements Bandwidth Chip scale packaging Fabrication Frequency measurement Gain measurement Patch antennas Wafer bonding Wafer scale integration |
| Year: | 2003 |
| Country: | Portugal |
| Document type: | conference paper |
| Access type: | open access |
| Associated institution: | Universidade do Minho |
| Language: | English |
| Origin: | RepositóriUM - Universidade do Minho |
| Summary: | We report on design, fabrication and characterization of chip-size antennas for operation at 5.7 GHz and use in wireless sensor networks. Application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna types (patch and folded patch) allows on-chip integration and is the main novelty of our work. A short-range wireless link between two systems both equipped with an 8x8 mm2 patch antenna (measured characteristics: 5.705 GHz central frequency, 90 MHz bandwidth @ -10 dB, 0.3 dB gain, 18% efficiency) realized on a high-resistivity silicon (HRS) substrate is demonstrated. A folded-patch antenna built on two stacked glass substrates allows size reduction down to 4.5x4x1 mm3 and has a projected efficiency of 60%. |
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