Publication
Design and analysis of a 6 GHz chip antenna on glass substrates for integration with RF/wireless microsystems
| Summary: | We report on design and characterization of chip-size antennas for operation at 6 GHz and use in wireless microsystems. Use of a glass substrate and application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna type allows on-chip integration and is the main issue of our work. A short-range wireless link between two systems both equipped with a 11.7x12.4 mm2 patch antenna (measured characteristics: 6 GHz central frequency, 100 MHz bandwidth @ -10 dB, 3 dB gain, 51% efficiency) realized on a Corning Pyrex #7740 glass substrate is demonstrated. |
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| Main Authors: | Mendes, P. M. |
| Other Authors: | Bartek, M.; Burghartz, J. N.; Correia, J. H. |
| Subject: | Chip size antenna Antenna on glass Antenna integration Wireless microsystem |
| Year: | 2003 |
| Country: | Portugal |
| Document type: | conference paper |
| Access type: | open access |
| Associated institution: | Universidade do Minho |
| Language: | English |
| Origin: | RepositóriUM - Universidade do Minho |
| Summary: | We report on design and characterization of chip-size antennas for operation at 6 GHz and use in wireless microsystems. Use of a glass substrate and application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna type allows on-chip integration and is the main issue of our work. A short-range wireless link between two systems both equipped with a 11.7x12.4 mm2 patch antenna (measured characteristics: 6 GHz central frequency, 100 MHz bandwidth @ -10 dB, 3 dB gain, 51% efficiency) realized on a Corning Pyrex #7740 glass substrate is demonstrated. |
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